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ANDROMEDA DWI LAKSONO

Institut Teknologi Kalimantan S1 - Teknik Material dan Metalurgi SINTA ID : 6196489
1.474
SINTA Score Overall
680
SINTA Score 3Yr
0
Affil Score
0
Affil Score 3Yr
Latest number of publications
  Scopus Analysis  

Dissolution Behavior of the Cu-2.0 wt% Be Alloy (Alloy 25) in Molten Sn, Sn-3.0 wt% Ag-0.5 wt% Cu, and Sn-58 wt% Bi Lead-free Solders
Q2 as Journal JOM
Author Order : 2 of 6     Creator : Yen Y.W.
2025 1 cited
Effect of current density and temperature variations of chrome electroplating process on thickness, hardness and corrosion rate of AISI 1045 steel
Q4 as Conference Proceedin Aip Conference Proceedings
Author Order : 1 of 6     Creator : Laksono A.D.
2025 0 cited
Technical analysis of rattan and jute fiber reinforced composite materials
Q4 as Conference Proceedin Aip Conference Proceedings
Author Order : 6 of 7     Creator : Alamsyah
2025 0 cited
Phase equilibria and thermodynamics assessment of the Co–Fe–Nb ternary system
Q1 as Journal Intermetallics
Author Order : 3 of 4     Creator : Hutabalian Y.
2024 2 cited
Photocatalytic Reduction of Nitrophenol and Nitrobenzene with Zn Oxysulfide Semiconductor Without Using Reducing Agents
no-Q as Book Solar Light to Hydrogenated Organic Conversion Heterogeneous Photocatalysts
Author Order : 2 of 5     Creator : Ernawati L.
2024 1 cited
Solid/Solid Interfacial Reactions in the Sn/C7025 and Sn-3.0 wt%Ag-0.5wt%Cu/C7025 Couples
no-Q as Conference Proceedin 2024 International Conference on Electronics Packaging Icep 2024
Author Order : 2 of 3     Creator : Chou J.T.
2024 0 cited
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple
Q2 as Journal Soldering and Surface Mount Technology
Author Order : 1 of 3     Creator : Laksono A.D.
2024 1 cited
Dissolution Behavior of Cu-0.1wt.% Fe C19210 in Molten Sn & SAC305 Solders
no-Q as Conference Proceedin 2024 International Conference on Electronics Packaging Icep 2024
Author Order : 1 of 3     Creator : Laksono A.D.
2024 0 cited
Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder
Q2 as Journal JOM
Author Order : 1 of 4     Creator : Laksono A.D.
2024 3 cited
Bi Segregation in the Solid/Liquid Cu-0.1 wt.% Fe (C19210)/Sn-58Bi Solder
no-Q as Conference Proceedin 2024 International Conference on Electronics Packaging Icep 2024
Author Order : 1 of 3     Creator : Laksono A.D.
2024 0 cited
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Summary

Article Quartile
Research Output
  Scopus GScholar WOS
Article 32 81 18
Citation 125 367 55
Cited Document 25 58 13
H-Index 7 12 4
i10-Index 5 13 1
G-Index 1 1 2
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